3D Printing 2023

Scisynopsis is happy to announce that it successfully completed “International Conference on 3D Printing & Additive Manufacturing” held on March 20-21, 2023 at Dubai, UAE, with the theme “Exploring New Innovations in 3D Printing & Manufacturing Technologies” with great success. We sincerely thank the renowned scientists, distinguished researchers from different universities, research institutes, companies, laboratories with the latest knowledge on topics related to 3D Printing & Additive Manufacturing. The conference was remarked with huge success followed by Keynote Sessions, followed by Oral presentations, poster presentations video presentations. The highlights of the meetings are presented by: 

• Andreas Heinrich, Aalen University, Germany 
• William O’Neill, University of Cambridge, United Kingdom
• Zhiyong Cai, Forest Products Laboratory USDA, USA
• Julian Polte, IWF TU Berlin and Fraunhofer IPK, Germany
• Antonios Dimopoulos, Brunel University London, United Kingdom
• Ana Pilipović, University of Zagreb, Croatia
• Terence Xiaoteng Liu, University of Northumbria, United Kingdom
• Zeina Al-Nabulsi, Warwick University, DYSE, United Kingdom
• Sudhir Sharma, New York University Abu Dhabi, UAE
• Vyas Mani Sharma, Tel Aviv University, Israel
• Daniel Q Tan, Guangdong Technion – Israel Institute of Technology, China
• Ivan Stich, Slovak Academy of Sciences, Slovakia Republic
• Giada Gasparini, DICAM – University of Bologna, Italy
• Shueiwan H. Juang, National Taiwan Ocean University, Taiwan
• Martin Nozar, University of West Bohemia, Czech Republic
• Norbert Hampp, University of Marburg, Germany
• Aleksey Adamtsevich, Moscow State University of Civil Engineering, Russia
• Muhammad Zafar Iqbal, United Arab Emirates University, UAE
• Nikita Ryskin, Saratov State University, Russia
• Poonam Kumari, IIT Guwahati, India
• Vladimir Popov, Tel Aviv University, Israel
• Prahaladh Srikanth, SA 3D Solutions, India
• Rahim Mutlu, University of Wollongong in Dubai, UAE
• Umar Asghar, University of Wollongong in Dubai, UAE
• Atanu Kumar Metya, (IIT) Patna, India
• Rouslan Svintsitski, 3DCeram Sinto SAS, France
• Igor V. Reshetov, Sechenov University, Russia
• Sudhir Sharma, New York University Abu Dhabi, UAE
• Haider Butt, Khalifa Uniersity, Abu Dhabi, UAE
• Markéta Havrdová, Palacký University, Czech Republic
• Roberto Marsili, University of Perugia, Italy
• Boris Ezdin, Novosibirsk State University, Russia
• Tatjana Dostalova, Charles University, Czech Republic
• Jolanta Janutėnienė, Klaipeda University, Lithuania
• Alexander Emmanuel Tohidi, UNSW, Australia
• Dingwen Nic Bao, School of Architecture and Urban Design, Australia
• Xin Ren, Nanjing Tech University, China
• Darío González Fernández, INDAERO GRUPO EMERGY, Spain
• M. A. Fazal, University of Jeddah, Saudi Arabia
• Abhay Meena, Lok Nayak hospital, India
• Ibrahim Maouhoubi, Sidi Mohamed Ben Abdellah University, Morocco
• Vijeth H, Nagaland Central University, India
• Ajeet Kumar, Indian Institute of Technology (IIT) Guwahati, India
• Seongwoo Woo, Ethiopian Technical University, Ethiopia
• Amna Mazen, University of Detroit Mercy, USA
• Abdus Salam Sarkar, Stevens Institute of Technology, USA
• K. Saravanan, SRM Institute of Science and Technology, India
• M. Irfan Hussain, University Of Science And Technology Beijing, China
• Mohammad Tanvir Ahmed, Jashore University of Science and Technology, Bangladesh
• Shahzad Ashraf, NFC Institute of Engineering and Technology, Pakistan
• Farah Marsusia, Amirkabir University of Technology, Iran
• B. Renganathan, Saveetha Institute of Medical and Technical Sciences, India
• Tunji John Erinle, Federal Polytechnic, Ekiti State, Nigeria
• Robin Singla, Thapar Institute of Engineering and Technology, India
• Sangeeta Tiwari, Amity University, India

We would like to thank our Session chairs: Andreas Heinrich, William O’Neill, Norbert Hampp, and Zhiyong Cai & who supported us for the conference. 
We once again thankful to our all our attendees who presented their valuable work in the conference and supported us. 
Thank you.