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3D Printing 2023

Scisynopsis is happy to announce that it successfully completed “International Conference on 3D Printing & Additive Manufacturing” held on March 20-21, 2023 at Dubai, UAE, with the theme “Exploring New Innovations in 3D Printing & Manufacturing Technologies” with great success. We sincerely thank the renowned scientists, distinguished researchers from different universities, research institutes, companies, laboratories with the latest knowledge on topics related to 3D Printing & Additive Manufacturing. The conference was remarked with huge success followed by Keynote Sessions, followed by Oral presentations, poster presentations video presentations. The highlights of the meetings are presented by: 

  • Andreas Heinrich, Aalen University, Germany 
  • William O’Neill, University of Cambridge, United Kingdom
  • Zhiyong Cai, Forest Products Laboratory USDA, USA
  • Julian Polte, IWF TU Berlin and Fraunhofer IPK, Germany
  • Antonios Dimopoulos, Brunel University London, United Kingdom
  • Ana Pilipović, University of Zagreb, Croatia
  • Terence Xiaoteng Liu, University of Northumbria, United Kingdom
  • Zeina Al-Nabulsi, Warwick University, DYSE, United Kingdom
  • Sudhir Sharma, New York University Abu Dhabi, UAE
  • Vyas Mani Sharma, Tel Aviv University, Israel
  • Daniel Q Tan, Guangdong Technion – Israel Institute of Technology, China
  • Ivan Stich, Slovak Academy of Sciences, Slovakia Republic
  • Giada Gasparini, DICAM – University of Bologna, Italy
  • Shueiwan H. Juang, National Taiwan Ocean University, Taiwan
  • Martin Nozar, University of West Bohemia, Czech Republic
  • Norbert Hampp, University of Marburg, Germany
  • Aleksey Adamtsevich, Moscow State University of Civil Engineering, Russia
  • Muhammad Zafar Iqbal, United Arab Emirates University, UAE
  • Nikita Ryskin, Saratov State University, Russia
  • Poonam Kumari, IIT Guwahati, India
  • Vladimir Popov, Tel Aviv University, Israel
  • Prahaladh Srikanth, SA 3D Solutions, India
  • Rahim Mutlu, University of Wollongong in Dubai, UAE
  • Umar Asghar, University of Wollongong in Dubai, UAE
  • Atanu Kumar Metya, (IIT) Patna, India
  • Rouslan Svintsitski, 3DCeram Sinto SAS, France
  • Igor V. Reshetov, Sechenov University, Russia
  • Sudhir Sharma, New York University Abu Dhabi, UAE
  • Haider Butt, Khalifa Uniersity, Abu Dhabi, UAE
  • Markéta Havrdová, Palacký University, Czech Republic
  • Roberto Marsili, University of Perugia, Italy
  • Boris Ezdin, Novosibirsk State University, Russia
  • Tatjana Dostalova, Charles University, Czech Republic
  • Jolanta Janutėnienė, Klaipeda University, Lithuania
  • Alexander Emmanuel Tohidi, UNSW, Australia
  • Dingwen Nic Bao, School of Architecture and Urban Design, Australia
  • Xin Ren, Nanjing Tech University, China
  • Darío González Fernández, INDAERO GRUPO EMERGY, Spain
  • M. A. Fazal, University of Jeddah, Saudi Arabia
  • Abhay Meena, Lok Nayak hospital, India
  • Ibrahim Maouhoubi, Sidi Mohamed Ben Abdellah University, Morocco
  • Vijeth H, Nagaland Central University, India
  • Ajeet Kumar, Indian Institute of Technology (IIT) Guwahati, India
  • Seongwoo Woo, Ethiopian Technical University, Ethiopia
  • Amna Mazen, University of Detroit Mercy, USA
  • Abdus Salam Sarkar, Stevens Institute of Technology, USA
  • K. Saravanan, SRM Institute of Science and Technology, India
  • M. Irfan Hussain, University Of Science And Technology Beijing, China
  • Mohammad Tanvir Ahmed, Jashore University of Science and Technology, Bangladesh
  • Shahzad Ashraf, NFC Institute of Engineering and Technology, Pakistan
  • Farah Marsusia, Amirkabir University of Technology, Iran
  • B. Renganathan, Saveetha Institute of Medical and Technical Sciences, India
  • Tunji John Erinle, Federal Polytechnic, Ekiti State, Nigeria
  • Robin Singla, Thapar Institute of Engineering and Technology, India
  • Sangeeta Tiwari, Amity University, India

We would like to thank our Session chairs: Andreas Heinrich, William O’Neill, Norbert Hampp, and Zhiyong Cai & who supported us for the conference. 
We once again thankful to our all our attendees who presented their valuable work in the conference and supported us. 
Thank you.


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